Come Join a leading innovator in semiconductor technologies for high-voltage power conversion. Our products are key building blocks in the clean-power ecosystem, enabling renewable energy as well as the efficient transmission and consumption of power in a vast range of applications including appliances, mobile devices, computers, and countless industrial applications. Job Responsibilities Responsible for defining substrate/package design rules, process flow, and material set for new automotive power module packages. Drive alignment between module substrate (PCB) design requirements and supplier capabilities to enable new product development and volume manufacturing of power modules. Develop new assembly technologies, run process DOEs, to define process windows for new package development. Drive reliability testing and qualification of new automotive module packages in conjunction with the reliability group. Work closely with offshore assembly and substrate partners to develop new processes. Collaborate with IC design teams to define package design rules and packages to meet their requirements. Collaborate with multi-functional teams within Power Integrations for successful development, qualification, and production ramp of new module products. Job Requirements BS Degree in Electrical Engineering, Mechanical Engineering, or Material Science. Minimum of 12 years of experience in semiconductor packaging technology. Experience with leaded multi-die packages. Understanding of organic laminate technologies manufacturing and supplier capabilities. Experience in SMT or passive integrated package assembly is a plus. Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation (Flip Chip is a plus). Experience with package substrate design rules and tools (including AutoCAD). Knowledge of AEQ Automotive reliability requirements. Knowledge of APQP automotive development process. Knowledge of JEDEC/IPC design standards. Ability to set up Design Rule Checks for verification of every aspect of the PCB layout is a plus. Willingness to travel to Asia to attend technology reviews and resolve subcon/supplier issues. J-18808-Ljbffr
